Employer description & source details
Define validation plans, specifications-to-test mapping, and acceptance criteria for laser, silicon photonic, and packaging components and interfaces Build and run characterization setups for semiconductor lasers: LIV, optical spectrum, side-mode suppression, wavelength versus temperature and current, relative intensity noise, and modulation and extinction performance Characterize silicon photonic devices at die and wafer level: waveguide and coupler loss, modulator and photodetector performance, wavelength-dependent behavior, and thermal tuning response Develop precision measurement methods for fiber-to-chip and chip-to-chip interfaces — fiber arrays, micro-optics, edge and grating couplers — including insertion loss, alignment tolerance, and polarization dependence Correlate component, wafer, and package measurements with optical models to pinpoint the physical causes of excess loss and performance variation Define test structures and measurement requirements for new devices and interfaces with the photonics design and packaging teams Establish incoming inspection and sampling plans for supplier parts, and correlate measurements with supplier data and across labs Support component-level reliability and burn-in testing in partnership with the reliability team Automate measurements and build the data pipelines that make component results traceable from supplier lot to assembled engine Communicate findings and recommend design, component, or assembly changes to internal teams and suppliers Bachelor's degree in Optics, Photonics, Physics, Electrical Engineering, or a related field with 5+ years of relevant industry experience Hands-on experience characterizing semiconductor lasers and photonic components in a lab Solid understanding of laser physics, Gaussian beam optics,
Extracted skills: python, go, data analysis