Employer description & source details
Bachelor’s or master’s degree in Electrical engineering, Electronics Engineering, Materials Science, Photonics, or a related technical discipline. Minimum 5 years of experience in semiconductor test, product engineering, or manufacturing operations, with direct engagement with foundries and OSAT partners. Deep expertise in semiconductor backend (post-fab) manufacturing —with strong, hands-on understanding of wafer-level dicing, bumping, and assembly —including: Wafer-level dicing/singulation : street layout awareness, saw/laser process fundamentals, tape/film selection, kerf/edge quality control, and dicing-to-pick handling. Wafer bumping (e.g., Cu pillar / solder bump): process flow understanding (UBM/metallization, plating, reflow), bump metrology, reliability risks, and supplier control plans. Die/chiplet assembly and packaging : die attach, pick-and-place/flip-chip, underfill/encapsulation, substrate/interposer considerations, and in-process quality checks through final test readiness. Proven track record managing OSAT operations end-to-end, including production scheduling, execution, yield tracking, and vendor performance management. Strong experience in yield engineering and data-driven problem solving, with demonstrated ability to lead root cause analysis and drive corrective actions to closure across external partners. Hands-on expertise in optical testing, including characterization, validation, and troubleshooting of photonic or optical devices is a plus Advanced analytical skills with strong proficiency in Python for data analysis, automation, and yield modelling. Solid experience with LabVIEW for test automation, instrumentation control, and data acquisition in production or R&D environments. Strong understanding of cost-of-test drivers and test optimization
Extracted skills: python, data analysis, operations